BGA Placement / Rework

Removal and replacement of Ball Grid Array (BGA) devices right down to micro BGA format.

Volume circuit and system production

Fully automated high-speed surface mount line with placement capabilities ranging from 0402 and 0603 chip.

X-Ray and Visual Inspection

Many years of expertise interpreting x-ray images. We carry out 100% X-ray inspection on ALL BGA devices.

Rapid Prototyping on PCBs

Fast turnaround

Excellent build quality

Pressfit assembly with minimal tooling costs.

Functional Tests

Highly experienced team of test/repair engineers with a vast knowledge of many types of electronic systems.